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ZRB18AC81C106ME01_ (0603, x6s:eia, 10uf, dc16v) _: packaging code reference sheet 1.scope 2.murata part no. system (ex.) 3. type & dimensions (unit:mm) 4.rated value 5.package product specifications in this catalog are as of apr.3,2018,and are subject to change or obsolescence without notice. please consult the approval sheet before ordering. please read rating and !cautions first. (3) temperature characteristics (public std code):x6s(eia) g 0.2 to 0.65 (5) nominal capacitance mark (4) rated voltage packaging unit dc 16 v temp. range (ref.temp.) (8) packaging -22 to 22 % -55 to 105 c (25 c) only reflow soldering 0.6 min. (1)-1 l 1.60.2 (1)-2 w 0.80.2 this product specification is applied to chip multilayer ceramic capacitors on interposer board used for general electronic equipment. this product is applied for only reflow soldering. (2) t e chip multilayer ceramic capacitors on interposer board for general purpose specifications and test methods (operating temp. range) temp. coeff or cap. change 20 % (6) capacitance tolerance 10 uf 1.00.2 -55 to 105 c l f 180mm reel embossed w8p4 3000 pcs./reel k f 330mm reel embossed w8p4 8000 pcs./reel (1)l/w dimensions (2)t dimensions (3)temperature characteristics (4)rated voltage (5)nominal capacitance (6)capacitance tolerance (8)packaging code (7)muratas control code ZRB18AC81C106ME01-01 1 zrb 18 a c8 1c 106 m e01 l
specifications and test methods no 1 rated voltage shown in rated value. the rated voltage is defined as the maximum voltage which may be applied continuously to the capacitor. when ac voltage is superimposed on dc voltage, v p-p or v o-p , whichever is larger, should be maintained within the rated voltage range. 2 appearance no defects or abnormalities. visual inspection. 3 dimension within the specified dimensions. using measuring instrument of dimension. 4 voltage proof no defects or abnormalities. measurement point : between the terminations test voltage : 250% of the rated voltage applied time : 1 to 5 s charge/discharge current : 50ma max. to apply the test voltage through the interposer board termination. 5 insulation resistance(i.r.) more than 2000m or 50 ? f (whichever is smaller) measurement point : between the terminations measurement voltage : dc rated voltage charging time : 1 min charge/discharge current : 50ma max. measurement temperature: room temperature to apply the test voltage through the interposer board termination. 6 capacitance
shown in rated value. measurement temperature: room temperature 7 dissipation factor (d.f.) 0.1 max. to apply the test voltage through the interposer board termination. 8 temperature no bias r6 : within +/-10% (-55c to +85c) the capacitance change should be measured after 5 min. characteristics r7 : within +/-15% (-55c to +125c) at each specified temp. stage. of capacitance c8 : within +/-22% (-55c to +105c) capacitance value as a reference is the value in step 3. d7 : within +22/-33% (-55c to +125c) measurement voltage : less than 1.0vrms (refer to the individual data sheet) to apply the test voltage through the interposer board termination. ? initial measurement perform a heat treatment at 150+0/-10c for 1h and then let sit for 24+/-2h at room temperature,then measure. 9 adhesive strength no removal of the terminations or other defect solder the capacitor on the test substrate shown in fig.3. of termination should occur. applied force : 5n holding time : 10+/-1s applied direction : in parallel with the test substrate and vertical with the capacitor side. 10 vibration
appearance no defects or abnormalities. solder the capacitor on the test substrate shown in fig.3. capacitance within the specified initial value. kind of vibration : a simple harmonic motion 10hz to 55hz to 10hz (1min) total amplitude : 1.5mm d.f. within the specified initial value. this motion should be applied for a period of 2h in each 3 mutually perpendicular directions(total of 6h). item specification test method (ref. standard:jis c 5101, iec60384 jemcgs-05965 2 capacitance frequency voltage c Q 10f (10v min. ) 1 .0 +/ - 0.1khz 1.0 +/ - 0.2vrms c Q 10f (6.3v max. ) 1 .0 +/ - 0.1khz 0.5 +/ - 0.1vrms c 10f 120 +/ - 24hz 0.5 +/ - 0.1vrms step temperature( ? c ) applying v oltage(v dc ) 1 reference temp. +/ - 2 no bias 2 min.operating temp. +/ - 3 3 reference temp. +/ - 2 4 max.operating temp. +/ - 3 5 reference temp. +/ - 2
no 11 substrate appearance no defects or abnormalities. solder the capacitor on the test substrate shown in fig.1. bending test pressurization method : shown in fig.2 flexure : 1mm capacitance within +/-10% holding time : 5+/-1s change soldering method : reflow soldering 12 solderability of 95% of the terminations is to be soldered evenly and test method : solder bath method

interposer board termination continuously. flux : solution of rosin ethanol 25(mass)% preheat : 80 to 120 for 10s to 30s solder : sn-3.0ag-0.5cu solder temp. : 245+/-5 immersion time : 2+/-0.5s 13 resistance appearance no defects or abnormalities. test conditions : reflow method to solder : sn-3.0ag-0.5cu soldering capacitance within +/-7.5% solder temp. : 255+/-10 [peak temperature] heat change heat time of over 200c : 120s max. exposure time : 24+/-2h d.f. within the specified initial value. preheat : 150 to 160 for 2 min i.r. within the specified initial value. initial measurement perform a heat treatment at 150+0/-10c for 1h and then voltage proof no defects. let sit for 24+/-2h at room temperature,then measure. 14 temperature appearance no defects or abnormalities. solder the capacitor on the test substrate shown in fig.3. sudden change perform the five cycles according to the four heat treatments shown in the following table. capacitance within +/-7.5% change d.f. within the specified initial value. i.r. within the specified initial value. exposure time : 24+/-2h voltage proof no defects. initial measurement perform a heat treatment at 150+0/-10c for 1h and then let sit for 24+/-2h at room temperature,then measure. 15 high appearance no defects or abnormalities. solder the capacitor on the test substrate shown in fig.3. temperature test temperature : 40+/-2 high test humidity : 90%rh to 95%rh humidity capacitance within +/-12.5% test time : 500+/-12h (steady) change test voltage : dc rated voltage charge/discharge current : 50ma max. d.f. 0.2 max. initial measurement perform a heat treatment at 150+0/-10c for 1h and then i.r. more than 500m or 12.5 ? f (whichever is smaller) let sit for 24+/-2h at room temperature,then measure. measurement after test perform a heat treatment at 150+0/-10c for 1h and then let sit for 24+/-2h at room temperature,then measure. 16 durability appearance no defects or abnormalities. solder the capacitor on the test substrate shown in fig.3. test temperature : max. operating temp. +/-3 capacitance within +/-12.5% test time : 1000+/-12h change test voltage : 150% of the rated voltage charge/discharge current : 50ma max. d.f. 0.2 max. initial measurement perform a heat treatment at 150+0/-10c for 1h and then let sit for 24+/-2h at room temperature,then measure. measurement after test i.r. more than 1000m or 25 ? f (whichever is smaller) perform a heat treatment at 150+0/-10c for 1h and then let sit for 24+/-2h at room temperature,then measure. item specification test method (ref. standard:jis c 5101, iec60384 jemcgs-05965 3 step temp.( ? c ) time (m in ) 1 min. operating temp.+0/ - 3 30 +/ - 3 2 room temp 2 to 3 3 max. operating temp.+3/ - 0 30 +/ - 3 4 room temp 2 to 3
test method : substrate bending test ? test substrate material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm (zrb15: t:0.8mm) copper foil thickness : 0.035mm : solder resist (coat with heat resistant resin for solder) fig.1 (in mm) ? kind of solder : sn-3.0ag-0.5cu ? pressurization method fig.2 (in mm) adhesive strength of termination, vibration, temperature sudden change, resistance to soldering heat (reflow method) high temperature high humidity(steady) , durability ? test substrate material : copper-clad laminated sheets for pcbs (glass fabric base, epoxy resin) thickness : 1.6mm or 0.8mm copper foil thickness : 0.035mm ? kind of solder : sn-3.0ag-0.5cu ? land dimensions fig.3 jemcgs-05965 4 c b a solder resist chip capacitor land 100 40 a c b land f 4.5 c 2 4.0 0.1 8.0 0.3 3.5 0.05 0.05 1 1.5 +0.1 - 0 t * 1,2 2.0 0.05 1.75 0.1 45 45 flexure capacitance meter pressurization speed 1.0mm/ s support capacitor pressurize 45 45 r 5 20 50 min. type dimension (mm) a b c zrb 15 0.4 1.5 0.5 zrb 18 1.0 3.0 1.2 type dimension (mm) a b c zrb 15 0.4 1.5 0.5 zrb 18 1.0 3.0 1.2
1.tape carrier packaging(packaging code:d/l/j/k) 1.1 minimum quantity(pcs./reel) 1.2 dimensions of tape (1)zrb15 (in:mm) 7 *3 nominal value 1.0+0.22/-0.2 0.70.15 1.00.2 0.50.2 1.00.22 0.650.2 1.3 0.95 zrb15 x 1.00.15 0.50.15 0.650.15 0.8 l w t a *3 b *3 t *3 type product dimensions 10000 zrb18 a 3000 8000 6 4000 zrb15 x/7 8000 30000 code:d code:l code:j code:k package zrb type type 180mm reel 330mm reel paper tape plastic tape paper tape plastic tape jemcgp-02345f 5 *1,2 2 .0 0. 05 4.0 0.1 *1 1.5 +0.1 - 0 1.75 0.1 8.0 0.3 3.5 0.05 t *2 0.05 max. 2 4.0 0.1 8.0 0.3 3.5 0.05 0.05 1 1.5 +0.1 - 0 t * 1,2 2.0 0.05 1.75 0.1
(2)zrb18 (in:mm) l w t 6 1.60.22 0.60.2 a 1.60.2 1.00.2 *1 nominal value type product dimensions a *1 b *1 t zrb18 0.80.2 1.1 2.0 1.7 max. package zrb type jemcgp-02345f 6 8.0 0.3 4.0 0.1 3.5 0.05 1.75 0.1 t 2 .0 0.1 1.5 +0.1 - 0 4.0 0.1 0.2 5 0.1
package zrb type jemcgp-02345f 7 1 ??????B ( g mm) 210.8 1 w w w 1 zr b 15/ 18 16.5 max. 101.5 180+0/ - 3.0 330 2.0 50 min. 130.5 2.00.5 (in: mm) fig.1 package chips fig.2 dimensions of reel fig.3 taping diagram top tape : thickness 0.06 feeding hole :as specified in 1 .2. hole for chip : as specified in 1 .2. chip
1.3 tapes for capacitors are wound clockwise shown in fig.3. (the sprocket holes are to the right as the tape is pulled toward the user.) 1.4 part of the leader and part of the vacant section are attached as follows. (in:mm) 1.5 accumulate pitch : 10 of sprocket holes pitch = 40 0.3mm 1.6 chip in the tape is enclosed by top tape and bottom tape as shown in fig.1. 1.7 the top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches. 1.8 there are no jointing for top tape and bottom tape. 1.9 there are no fuzz in the cavity. 1.10 break down force of top tape : 5n min. break down force of bottom tape : 5n min. (only a bottom tape existence ) 1.11 reel is made by resin and appeaser and dimension is shown in fig 2. there are possibly to change the material and dimension due to some impairment. 1.12 peeling off force : 0.1 to 0.6n in the direction as shown below. 1.13 label that show the customer parts number, our parts number, our company name, inspection number and quantity, will be put in outside of reel. package zrbtype jemcgp-02345f 8 1 ??????B ( g mm) tail vacant section chip - mounting unit leader vacant section leader unit (top tape only) direction of feed 160 min. 190 min. 210 min. 1 ??????B ( g mm) 165 180 top tape
caution limitation of applications please contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. aircraft equipment aerospace equipment undersea equipment power plant control equipment medical equipment transportation equipment(vehicles,trains,ships,etc.) traffic signal equipment disaster prevention / crime prevention equipment data-processing equipment application of similar complexity and/or reliability requirements to the applications listed in the above. storage and operation condition 1. the performance of chip mlcc on interposer (zr series, henceforth just "capacitors") may be affected by the storage conditions. please use them promptly after delivery. 1-1. maintain appropriate storage for the capacitors using the following conditions: room temperature of +5 to +40 and a relative humidity of 20% to 70%. high temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging materials. if more than six months have elapsed since delivery, check packaging, mounting, etc. before use. in addition, this may cause oxidation of the electrodes. if more than one year has elapsed since delivery, also check the solderability before use. 1-2. corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result in poor solderability. do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.). 1-3. due to moisture condensation caused by rapid humidity changes, or the photochemical change caused by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and electrical performance may deteriorate. do not store capacitors under direct sunlight or in high huimidity conditions rating 1.temperature dependent characteristics 1. the electrical characteristics of the capacitor can change with temperature. 1-1. for capacitors having larger temperature dependency, the capacitance may change with temperature changes. the following actions are recommended in order to ensure suitable capacitance values. (1) select a suitable capacitance for the operating temperature range. (2) the capacitance may change within the rated temperature. when you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and carefully confirm the various characteristics in actual use conditions and the actual system. [example of temperature caracteristics x7r(r7)] [example of temperature characteristics x5r(r6)] sample: 0.1f, rated voltage 50vdc sample: 22f, rated voltage 4vdc ! jemcgc-02188e 9 - 20 - 10 - 15 - 5 5 0 10 15 20 temperature ( c) - 75 - 50 - 25 0 25 50 75 100 125 150 capacitance change (%) - 20 - 10 - 15 - 5 5 0 10 15 20 temperature ( c) - 75 - 50 - 25 0 25 50 75 100 capacitance change (%)
2.measurement of capacitance 1. measure capacitance with the voltage and frequency specified in the product specifications. 1-1. the output voltage of the measuring equipment may decrease occasionally when capacitance is high. please confirm whether a prescribed measured voltage is impressed to the capacitor. 1-2. the capacitance values of high dielectric constant type capacitors change depending on the ac voltage applied. please consider the ac voltage characteristics when selecting a capacitor to be used in a ac circuit. 3.applied voltage 1. do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications. 1-1. applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage. (1) when ac voltage is superimposed on dc voltage, the zero-to-peak voltage shall not exceed the rated dc voltage. when ac voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated dc voltage. (2) abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated dc voltage. typical voltage applied to the dc capacitor dc voltage dc voltage+ac ac voltage pulse voltage (e maximum possible applied voltage.) 1-2. influence of over voltage over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown of the internal dielectric layers . the time duration until breakdown depends on the applied voltage and the ambient temperature. 4.type of applied voltage and self-heating temperature 1.confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the continuous application of an ac voltage or pulse voltage. when a dc rated voltage product is used in an ac voltage circuit or a pulse voltage circuit, the ac current or pulse current will flow into the capacitor; therefore check the self-heating condition. please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits of the operating temperature, including the rise in temperature due to self-heating. when the capacitor is used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss. the load should be contained so that the self-heating of the capacitor body remains below 20c , when
measuring at an ambient temperature of 25c. caution ! 1 0 1 2 3 current (ar.m.s.) 4 5 6 temperature rise ( ) 100khz 10 100 ripple current 500khz 1mhz [ example of temperature rise (heat generation) in chip multilayer ceramic capacitors in contrast to ripple current] sample : r( r 1 ) characteristics 10 f, rated voltage : dc 10 v jemcgc-02188e 10 e e e e 0 0 0 0
5. dc voltage and ac voltage characteristic 1. the capacitance value of a high dielectric constant type capacitor changes depending on the dc voltage applied. please consider the dc voltage characteristics when a capacitor is selected for use in a dc circuit. 1-1. the capacitance of ceramic capacitors may change sharply depending on the applied voltage. (see figure) please confirm the following in order to secure the capacitance. (1) determine whether the capacitance change caused by the applied voltage is within the allowed range . (2) in the dc voltage characteristics, the rate of capacitance change becomes larger as voltage increases, even if the applied voltage is below the rated voltage. when a high dielectric constant type capacitor is used in a circuit that requires a tight (narrow) capacitance tolerance (e.g., a time constant circuit), please carefully consider the voltage characteristics, and confirm the various characteristics in the actual operating conditions of the system. 2. the capacitance values of high dielectric constant type capacitors changes depending on the ac voltage applied. please consider the ac voltage characteristics when selecting a capacitor to be used in a ac circuit. 6. capacitance aging [ example of change over time (aging characteristics) ] 1. the high dielectric constant type capacitors have an aging characteristic in which the capacitance value decreases with the passage of time. when you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance tolerance (e.g., a time-constant circuit), please carefully consider the characteristics of these capacitors, such as their aging, voltage, and temperature characteristics. in addition, check capacitors using your actual appliances at the intended environment and operating conditions. 7.vibration and shock 1. please confirm the kind of vibration and/or shock, its condition, and any generation of resonance. please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals. 2. mechanical shock due to being dropped may cause damage or a crack in the dielectric material of the capacitor. do not use a dropped capacitor because the quality and reliability may be deteriorated. 3. when printed circuit boards are piled up or handled, the corner of another printed circuit board should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor. caution - 100 - 80 - 60 - 40 - 20 0 20 0 10 20 30 dc voltage (v) 40 50 [ example of dc voltage characteristics] sample: r( r 1) characteristics 0.1f, rated voltage 50vdc capacitance change (%) 0 0.5 1 ac voltage (vr.m.s.) 1.5 2 [ example of ac voltage characteristics] sample: x7r( r7 ) characteristics 10f, rated voltage 6.3vdc capacitance change (%) 30 2 0 1 0 0 - 1 0 - 2 0 - 3 0 - 4 0 - 5 0 - 6 0 floor crack mounting printed circuit board crack ! jemcgc-02188e 11 20 10 0 - 10 - 20 - 30 - 40 10 100 1000 10000 time(h ) capacitance change (%) c0g( 5c ) x7r( r7 ) x5r( r6 )
soldering and mounting 1.mounting position 1. confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing or bending the printed circuit board. 1-1.choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board. [component direction] locate chip horizontal to the direction in which stress acts. (bad example) (good example) [chip mounting close to board separation point] it is effective to implement the following measures, to reduce stress in separating the board. it is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress. stress level (1) turn the mounting direction of the component parallel to the board separation surface. a > d *1 (2) add slits in the board separation part. a > b (3) keep the mounting position of the component away from the board separation surface. a > c *1 a > d is valid when stress is added vertically to the perforation as with hand separation. if a cutting disc is used, stress will be diagonal to the pcb, therefore a > d is invalid. [mounting capacitors near screw holes] when a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. mount the capacitor in a position as far away from the screw holes as possible. 2.information before mounting 1. do not re-use capacitors that were removed from the equipment. 2. confirm capacitance characteristics under actual applied voltage. 3. confirm the mechanical stress under actual process and equipment use. 4. confirm the rated capacitance, rated voltage and other electrical characteristics before assembly. 5. prior to use, confirm the solderability of capacitors that were in long-term storage. 6. prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage. 7.the use of sn-zn based solder will deteriorate the reliability of the mlcc. please contact our sales representative or product engineers on the use of sn-zn based solder in advance. caution contents of measures screw hole recommended ! jemcgc-02188e 12 1c 1 b 1 a perforation s lit a b c d 1 a
3.maintenance of the mounting (pick and place) machine 1. to adjust the inspection tolerance for automated appearance sorting machine of mounting position, because zr series are easier to shift the mounting position than standard mlcc. 2. to check the overturn and reverse of zr series. 3. to control mounting speed carefully, because zr series is heavier than standard mlcc. 4. make sure that the following excessive forces are not applied to the capacitors. check the mounting in the actual device under actual use conditions ahead of time. 4-1. in mounting the capacitors on the printed circuit board, any bending force against them shall be kept to a minimum to prevent them from any damage or cracking. please take into account the following precautions and recommendations for use in your process. (1) adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board. [incorrect] [correct] 2.dirt particles and dust accumulated in the suction nozzle and suction mechanism prevent the nozzle from moving smoothly. this creates excessive force on the capacitor during mounting, causing cracked chips. also, the locating claw, when worn out, imposes uneven forces on the chip when positioning, causing cracked chips. the suction nozzle and the locating claw must be maintained, checked and replaced periodically. caution ! jemcgc-02188e 13 board guide board suction nozzle deflection support pin
4-1.reflow soldering 1. when sudden heat is applied to the components, the [standard conditions for reflow soldering] mechanical strength of the components will decrease because a sudden temperature change causes deformation inside the components. in order to prevent mechanical damage to the components, preheating is required for both the components and the pcb. preheating conditions are shown in table 1. it is required to keep the temperature differential between the solder and the components surface (t) as small as possible. 2. when components are immersed in solvent after mounting, be sure to maintain the temperature difference (t) between the component and the solvent within the range shown in the table 1. [allowable reflow soldering temperature and time] table 1 series zrb recommended conditions in the case of repeated soldering, the accumulated soldering time must be within the range shown above. lead free solder: sn-3.0ag-0.5cu 3. when a capacitor is mounted at a temperature lower than the peak reflow temperature recommended by the
solder manufacturer, the following quality problems can occur. consider factors such as the placement of
peripheral components and the reflow temperature setting to prevent the capacitors reflow temperature from dropping below the peak temperature specified. be sure to evaluate the mounting situation beforehand and
verify that none of the following problems occur. ? drop in solder wettability ? solder voids ? possible occurrence of whiskering ? drop in bonding strength ? drop in self-alignment properties ? possible occurrence of tombstones and/or shifting on the land patterns of the circuit board 4-2.flow soldering 1. zr series is not apply flow soldering. 4-3.correction of soldered portion do not correct with a soldering iron for zr series. correction with a soldering iron for zr series may cause loss suppress acoustic noise, because the solder amount become excessive. peak temperature 240 to 260 atmosphere air or n 2 caution chip dimension(l/w) code temperature differential 15/18 t Q 190 lead free solder ! jemcgc-02188e 14 soldering temperature( ) soldering time(s ) 280 270 260 250 240 230 220 0 3 0 6 0 12 0 9 0 temperature( ) peak temperature soldering gradual cooling preheating t 60 - 120 seconds 30 - 60 seconds time 190 170 150 220
5.washing excessive ultrasonic oscillation during cleaning can cause the pcbs to resonate, resulting in cracked chips or broken solder joints. before starting your production process, test your cleaning equipment / process to insure it does not degrade the capacitors. 6.electrical test on printed circuit board 1. confirm position of the support pin or specific jig, when inspecting the electrical performance of a capacitor after mounting on the printed circuit board. 1-1. avoid bending the printed circuit board by the pressure of a test-probe, etc. the thrusting force of the test probe can flex the pcb, resulting in cracked chips or open solder joints. provide support pins on the back side of the pcb to prevent warping or flexing. install support pins as close to the test-probe as possible. 1-2. avoid vibration of the board by shock when a test -probe contacts a printed circuit board. [not recommended] [recommended] 7.printed circuit board cropping 1. after mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that caused bending or twisting the board. 1-1. in cropping the board, the stress as shown may cause the capacitor to crack. cracked capacitors may cause deterioration of the insulation resistance, and result in a short. avoid this type of stress to a capacitor. [bending] [twisting] 2. check the cropping method for the printed circuit board in advance. 2-1. printed circuit board cropping shall be carried out by using a jig or an apparatus (disc separator, router type separator, etc.) to prevent the mechanical stress that can occur to the board. * when a board separation jig or disc separator is used, if the following precautions are not observed, a large board deflection stress will occur and the capacitors may crack. use router type separator if at all possible. notes hand and nipper separation apply a high level of stress. use another method. board handling board bending direction layout of capacitors board handling layout of slits design of v groove arrangement of blades controlling blade life board handling level of stress on board high medium medium low recommended * * ? caution board separation method hand separation nipper separation (1) board separation jig board separation apparatus 2) disc separator 3) router type separator ! peeling test - probe support pin test - probe jemcgc-02188e 15 1 a
(1) example of a suitable jig [in the case of single-side mounting] an outline of the board separation jig is shown as follows. recommended example: stress on the component mounting position can be minimized by holding the portion close to the jig, and bend in the direction towards the side where the capacitors are mounted. not recommended example: the risk of cracks occurring in the capacitors increases due to large stress being applied to the component mounting position, if the portion away from the jig is held and bent in the direction opposite the side where the capacitors are mounted. [outline of jig] [hand separation] [in the case of double-sided mounting] since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the above method. therefore, implement the following measures to prevent stress from being applied to the components. (measures) (1) consider introducing a router type separator. if it is difficult to introduce a router type separator, implement the following measures. (refer to item 1. mounting position) (2) mount the components parallel to the board separation surface. (3) when mounting components near the board separation point, add slits in the separation position near the component. (4) keep the mounting position of the components away from the board separation point. (2) example of a disc separator an outline of a disc separator is shown as follows. as shown in the principle of operation, the top blade and bottom blade are aligned with the v-grooves on the printed circuit board to separate the board. in the following case, board deflection stress will be applied and cause cracks in the capacitors. (1) when the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom, left-right or front-rear directions (2) the angle of the v groove is too low, depth of the v groove is too shallow, or the v groove is misaligned top-bottom if v groove is too deep, it is possible to brake when you handle and carry it. carefully design depth of the v groove with consideration about strength of material of the printed circuit board. [ outline of machine ] [ principle of operation ] [ cross-section diagram ] [disc separator] top blade top blade top blade top blade bottom blade bottom blade bottom blade bottom blade [v-groove design] depth too shallow depth too deep example of recommended v-groove design not recommended left-right misalignment low-angle caution recommended not recommended recommended not recommended top-bottom misalignment left-right misalignment front-rear misalignment printed circuit board top blade v - groove bottom blade top blade printed circuit board v - groove ! board cropping jig v - groove printed circuit board jemcgc-02188e 16 printed circuit board components load point direction of load printed circuit board component s load point direction of load
(3) example of router type separator the router type separator performs cutting by a router rotating at a high speed. since the board does not bend in the cutting process, stress on the board can be suppressed during board separation. when attaching or removing boards to/from the router type separator, carefully handle the boards to prevent bending. 8. assembly 1. handling if a board mounted with capacitors is held with one hand, the board may bend. firmly hold the edges of the board with both hands when handling. if a board mounted with capacitors is dropped, cracks may occur in the capacitors. do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired. 2. attachment of other components 2-1. mounting of other components pay attention to the following items, when mounting other components on the back side of the board after capacitors have been mounted on the opposite side. when the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied to the capacitors on the back side (bottom side), and cracks may occur in the capacitors. after the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board. periodically check and adjust the bottom dead point. 2-2. inserting components with leads into boards when inserting components (transformers, ic, etc.) into boards, bending the board may cause cracks in the capacitors or cracks in the solder. pay attention to the following. increase the size of the holes to insert the leads, to reduce the stress on the board during insertion. fix the board with support pins or a dedicated jig before insertion. support below the board so that the board does not bend. when using support pins on the board, periodically confirm that there is no difference in the height of each support pin. 2-3. attaching/removing sockets and/or connectors insertion and removal of sockets and connectors,
etc., might cause the board to bend. please insure
that the board does not warp during insertion and
removal of sockets and connectors, etc., or the
bending may damage mounted components on the
board. 2-4. tightening screws the board may be bent, when tightening screws, etc. during the attachment of the board to a shield or chassis. pay attention to the following items before performing the work. plan the work to prevent the board from bending. use a torque screwdriver, to prevent over-tightening of the screws. the board may bend after mounting by reflow soldering, etc. please note, as stress may be applied to the chips by forcibly flattening the board when tightening the screws. caution ! suction nozzle component with leads socket screwdriver [ outline drawing ] router jemcgc-02188e 17
others 1. under operation of equipment 1-1. do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock. 1-2. do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit). do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions. 1-3. confirm the environment in which the equipment will operate is under the specified conditions. do not use the equipment under the following environments. (1) being spattered with water or oil. (2) being exposed to direct sunlight. (3) being exposed to ozone, ultraviolet rays, or radiation. (4) being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.) (5) any vibrations or mechanical shocks exceeding the specified limits. (6) moisture condensing environments. 1-4. use damp proof countermeasures if using under any conditions that can cause condensation. 2. others 2-1. in an emergency (1) if the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment. if the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power. (2) in this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused by the capacitor's high temperature. 2-2. disposal of waste when capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate licenses. 2-3. circuit design (1) addition of fail safe function capacitors that are cracked by dropping or bending of the board may cause deterioration of the insulation resistance, and result in a short. if the circuit being used may cause an electrical shock, smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse, to prevent secondary accidents. (2) this series are not safety standard certified products. 2-4. remarks failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used. the above notices are for standard applications and conditions. contact us when the products are used in special mounting conditions. select optimum conditions for operation as they determine the reliability of the product after assembly. the data herein are given in typical values, not guaranteed ratings. caution ! jemcgc-02188e 18
rating 1.operating temperature 1. the operating temperature limit depends on the capacitor. 1-1. do not apply temperatures exceeding the maximum operating temperature. it is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range. it is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable factor. 1-2. consider the self-heating factor of the capacitor the surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating. 2.atmosphere surroundings (gaseous and liquid) 1. restriction on the operating environment of capacitors. 1-1. capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion of the terminations and the penetration of moisture into the capacitor. 1-2. the same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject to moisture condensation. 1-3. the deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents for long periods of time. 3.piezo-electric phenomenon 1. when using high dielectric constant type capacitors in ac or pulse circuits, the capacitor itself vibrates at specific frequencies and noise may be generated. moreover, when the mechanical vibration or shock is added to capacitor, noise may occur. notice jemcgc-02188e 19
soldering and mounting 1.pcb design 1. notice for pattern forms 1-1. there is a possibility of chip cracking caused by pcb expansion/contraction with heat, because stress

on a chip is different depending on pcb material and structure.when the thermal expansion coefficient greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to the thermal expansion and contraction. when capacitors are mounted on a fluorine resin printed circuit board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason. 2. land dimensions 2-1.please refer to the land dimensions in table 1 for zrb series. (1)recommended land dimensions table1 land dimensions 1.00.5 (0.15/0.20) (l:0.22,w:0.20) 1.60.8 (0.20) (l:0.22,w:0.20) (in mm) * if distance between parts is too short, there is risk to cause electrical short. please confirm the mounting pitch (distance between centers of parts) has 1.275mm or more. zrb18 only please confirm the suitable mounting condition by evaluating of the actual set / pcb. 3. board design when designing the board, keep in mind that the amount of strain which occurs will increase depending on the size and material of the board. zrb 15 0.4 0.6 0.4 0.5 0.5 0.7 zrb 18 * 0.7 0.9 0.7 0.8 0.8 1.0 notice series chip dimension (l/w) code chip(lw) (dimensions tolerance) a b c jemcgc-02188e 20 zrb c b a solder resist land relationship with amount of strain to the board thickness, length, width, etc.] = 3p l 2 e wh 2 relationship between load and strain when the load is constant, the following relationship can be established. as the distance between the supporting points (l) increases,the amount of strain also increases. red uce the distance between the supporting points. as the elastic modulus (e) decreases, the amount of strain increases. increase the elastic modulus. as the board width (w) decreases, the amount of strain increases. increase the width of the board. as the board thickness (h) decreases, the amount of strain increases. increase the thickness of the board. since the board thickness is squared, the effect on the amount of strain becomes even greater. strain on center of board ( st) l distance between supporting points (mm) w board width (mm) h board thickness ( mm) e elastic modulus of board (n/m 2 =pa) y deflection (mm) p load (n) y p h w l
2.reflow soldering the flux in the solder paste contains halogen-based substances and organic acids as activators. strong acidic flux can corrode the capacitor and degrade its performance. please check the quality of capacitor after mounting. 3.washing 1. please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality, and select the solvent for cleaning. 2. unsuitable cleaning may leave residual flux or other foreign substances, causing deterioration of electrical characteristics and the reliability of the capacitors. 4.coating 1. loss suppress acoustic noise may be caused in zr series due to the resin during curing process. please contact our sales representative or product engineers on the apply to resin during curing process. notice jemcgc-02188e 21
others 1.transportation 1. the performance of a capacitor may be affected by the conditions during transportation. 1-1. the capacitors shall be protected against excessive temperature, humidity and mechanical force during transportation. (1) climatic condition ? low air temperature : -40 ? change of temperature air/air : -25 /+25 ? low air pressure : 30 kpa ? change of air pressure : 6 kpa/min. (2) mechanical condition transportation shall be done in such a way that the boxes are not deformed and forces are not directly passed on to the inner packaging. 1-2. do not apply excessive vibration, shock, or pressure to the capacitor. (1) when excessive mechanical shock or pressure is applied to a capacitor, chipping or cracking may occur in the ceramic body of the capacitor. (2) when the sharp edge of an air driver, a soldering iron, tweezers, a chassis, etc. impacts strongly on the surface of the capacitor, the capacitor may crack and short-circuit. 1-3. do not use a capacitor to which excessive shock was applied by dropping etc. a capacitor dropped accidentally during processing may be damaged. 2.characteristics evaluation in the actual system 1. evaluate the capacitor in the actual system,to confirm that there is no problem with the performance and specification values in a finished product before using. 2. since a voltage dependency and temperature dependency exists in the capacitance of high dielectric type ceramic capacitors, the capacitance may change depending on the operating conditions in the actual system. therefore,be sure to evaluate the various characteristics, such as the leakage current and noise absorptivity, which will affect the capacitance value of the capacitor. 3. in addition,voltages exceeding the predetermined surge may be applied to the capacitor by the inductance in the actual system. evaluate the surge resistance in the actual system as required. notice jemcgc-02188e 22
note 1.please make sure that your product has been evaluated in view of your specifications with our product being mounted to your product. 2.your are requested not to use our product deviating from this product specification. 3.we consider it not appropriate to include any terms and conditions with regard to the business transaction in the product specifications, drawings or other technical documents. therefore, if your technical documents as above include such terms and conditions such as warranty clause, product liability clause, or intellectual property infringement liability clause, they will be deemed to be invalid. ! jemcgc-02188e 23

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